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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/30 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 2.7v to 5.5v input, 3.0a integrated mosfet single synchronous buck dc/dc converter BD9B301MUV-LB general description this is the product guarantees long time support in industrial market. BD9B301MUV-LB is a synchronous buck switching regulator with built-in low on-resistance power mosfets. this ic, which is capable of providing current up to 3a, features fast transient res ponse by employing constant on-time control system. it offers high oscillating frequency at low inductance. with its original constant on-time control method whic h operates low consumption at light load, this product is ideal for equipment and devices that demand minimal standby power consumption. features ? long time support product for industrial applications ? synchronous single dc/dc converter ? constant on-time control suitable to deep-sllm ? over current protection ? short circuit protection ? thermal shutdown protection ? under voltage lockout protection ? adjustable soft start ? power good output ? vqfn016v3030 package (backside heat dissipation) applications key specifications ? input voltage range: 2.7v to 5.5v ? output voltage range: 0.8 v to v pvin x 0.8 v ? maximum operating current: 3a (max) ? switching frequency: 2mhz/1mhz (typ) ? high-side mosfet on resistance: 35m ? (typ) ? low-side mosfet on resistance: 35m ? (typ) ? standby current: 0 a (typ) package w (typ) x d (typ) x h (max) vqfn016v3030 3.00 mm x 3.00 mm x 1.00 mm ? industrial equipment ? step-down power supply for dsps, fpgas, microprocessors, etc. ? storage devices (hdds/ssds) ? printers, oa equipment ? distributed power supply, secondary power supply typical application circuit figure 1. application circuit vqfn016v3030
datasheet d a t a s h e e t 2/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 pin configuration pin descriptions pin no. pin name function 1, 2 pvin power supply terminals for the switching regulator. these terminals supply power to the output stage of the switching regulator. connecting a 10f ceramic capacitor is recommended. 3, 4 pgnd ground terminals for the output stage of the switching regulator. 5 agnd ground terminal for the control circuit. 6 fb an inverting input node for the error amplifier and main comparator. see page 22 for how to calculate the resistance of the output voltage setting. 7 freq terminal for setting switching frequency. connecting this terminal to ground makes switching to operate constant on-time co rresponding to 2.0mhz. connecting this terminal to avin makes swit ching to operate constant on-time corresponding to 1.0mhz. please fix this terminal to avin or ground in operation. 8 mode terminal for setting switching control mode. c onnecting this terminal to avin forces the device to operate in the fixed frequenc y pwm mode. connecting this terminal to ground enables the deep-sllm control an d the mode is automatically switched between the deep-sllm control and fixed frequency pwm mode. please fix this terminal to avin or ground in operation. 9 ss terminal for setting the soft start time. t he rise time of the output voltage can be specified by connecting a capacitor to this terminal. see page 23 for how to calculate the capacitance. 10, 11, 12 sw switch nodes. these terminals are connec ted to the source of the high-side mosfet and drain of the low-side mosfet . connect a bootstrap capacitor of 0.1 f between these terminals and boot terminal. in addition, connect an inductor of 0.47h to 1h (freq=l), 1 h to 1.5 h (freq=h) considering the direct current superimposition characteristic. 13 boot terminal for bootstrap. connect a bootstrap capacitor of 0.1 f between this terminal and sw terminals. the voltage of this capacitor is the gate drive voltage of the high-side mosfet. 14 pgd a ?power good? terminal, an open drain output. use of pull up resistor is needed. see page 17 for how to specify the resistance. when the fb terminal voltage reaches more than 80% of 0.8 v, the internal nch mosfet turns off and the output turns high. 15 en enable terminal. turning this terminal signal low (0.8v or lower) forces the device to enter the shutdown mode. turning this terminal signal high (2.0v or higher) enables the device. this terminal must be terminated. 16 avin terminal for supplying power to the control circuit of the switching regulator. connecting a 0.1f ceramic capacitor is recommended. - e-pad a backside heat dissipation exposed pad. connecting to the internal pcb ground plane by using multiple vias provides excellent heat dissipation characteristics. figure 2. pin assignment (top view) agnd freq mode boot pgd en avin fb
datasheet d a t a s h e e t 3/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 block diagram figure 3. block diagram control logic + drv voltage reference tsd uvlo on time on time modulation fb mode pgd pgnd sw pvin en vout 3 8 1 6 4 2 avin 5 agnd 9 boot ss 7 freq pgood soft start error amplifier main comparator ocp scp pgd
datasheet d a t a s h e e t 4/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 description of blocks vref the vref block generates the internal reference voltage. uvlo the uvlo block is for under voltage lockout protection. it will shut down the ic when vin falls to 2.45 v (typ) or lower. the threshold voltage has a hysteresis of 100mv (typ). tsd the tsd block is for thermal protection. the thermal prot ection circuit shuts down the device when the internal temperature of ic rises to 175c (typ) or higher. therma l protection circuit resets when the temperature falls. the circuit has a hysteresis of 25c (typ). soft start the soft start circuit slows down the rise of output voltag e during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. a bu ilt-in soft start function is provided and a soft start is initiated in 1msec (typ) when the ss terminal is open. control logic + drv this block is a dc/dc driver. a signal from on time is applied to drive the mosfets. pgood when the fb terminal voltage reaches more than 80% of 0. 8 v, the nch mosfet of t he built-in open drain output turns off and the output turns high. ocp/scp after soft start is completed and in condition where output voltage is below 70% (typ) of voltage setting, it counts the number of times of which current flowing in high side fet reaches over current limit. when 512 times is counted it stops operation for 1m sec (typ) and re-operates. counting is reset when output voltage is above 80% (typ) of voltage setting or when en, uvlo, scp function is re-operated. error amplifier adjusts main comparator input to make internal reference voltage equal to fb terminal voltage. main comparator main comparator compares error amplifier output and fb terminal voltage. when fb terminal voltage becomes low it outputs high and reports to the on time block that the output voltage has dropped below control voltage. on time this is a block which creates on time. requested on ti me is created when main comparator output becomes high. on time is adjusted to restrict frequency ch ange even with input and output voltage change.
datasheet d a t a s h e e t 5/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage v pvin , v avin -0.3 to +7 v en terminal voltage v en -0.3 to +7 v mode terminal voltage v mode -0.3 to +7 v freq terminal voltage v freq -0.3 to +7 v pgd terminal voltage v pgd -0.3 to +7 v voltage from gnd to boot v boot -0.3 to +14 v voltage from sw to boot S v boot -0.3 to +7 v fb terminal voltage v fb -0.3 to +7 v sw terminal voltage v sw -0.3 to v pvin + 0.3 v output current i out 3.5 a allowable power dissipation (note 1) pd 2.66 w maximum junction temperature tjmax 150 ? c storage temperature range tstg -55 to 150 ? c (note 1) vqfn016v3030: derate by 21.3mw when operating above 25 ? c pcb size: 70mm x 70mm x 1.6mm when mounted on a 4-layer glass epoxy board (copper foil area: 70mm x 70mm) copper foil thickness: front side and reverse side 70m be used, 2nd and 3rd 35m be used. caution1: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. caution2: reliability is decreased at junction temperature greater than 125 ? c. recommended operating conditions parameter symbol min typ max unit supply voltage v pvin , v avin 2.7 - 5.5 v output current (note 2) i out - - 3 a output voltage range v range 0.8 - v pvin 0.8 v operating junction temperature range tj -40 - +125 ? c (note 2) pd, aso should not be exceeded.
datasheet d a t a s h e e t 6/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 electrical characteristics (unless otherwise specified ta=25c , v avin = v pvin = 5v, v en = 5v, v mode = gnd ) parameter symbol min typ max unit conditions avin pin standby supply current i stb - 0 10 a en=gnd operating supply current i cc - 45 80 a freq=avin, i out =0ma non switching uvlo detection threshold v uvlo1 2.35 2.45 2.55 v v in falling uvlo release threshold v uvlo2 2.425 2.55 2.7 v v in rising uvlo hysteresis v uvlohys 50 100 200 mv enable en input high level voltage v enh 2.0 - - v en input low level voltage v enl - - 0.8 v en input current i en - 5 10 a en=5v reference voltage, error amplifier fb terminal voltage1 v fb1 0.792 0.8 0.808 v fb terminal voltage2 v fb2 0.776 0.8 0.824 v tj=-40 to +125 ? c fb input bias current i fb - - 1 a fb=0.8v internal soft start time t ss 0.5 1.0 2.0 ms with internal constant soft start terminal current i ss 0.5 1.0 2.0 a control freq input high level voltage v frqh v avin -0.3 - - v freq input low level voltage v frql - - 0.3 v mode input high level voltage v modeh v avin -0.3 - - v mode input low level voltage v model - - 0.3 v on time1 ont1 96 120 144 ns v out =1.2v, freq=gnd on time2 ont2 192 240 288 ns v out =1.2v, freq=avin power good power good rising threshold v pgdh 75 80 85 % fb rising, v pgdh =fb/v fb x100 power good falling threshold v pgd l 65 70 75 % fb falling, v pgdl =fb/v fb x100 output leakage current i lkpgd - 0 5 a pgd=5v power good on resistance r pgd - 100 200 ? power good low level voltage p gdv l - 0.1 0.2 v i pgd =1ma sw high side fet on resistance r onh - 35 70 m ? boot-sw=5v low side fet on resistance r onl - 35 70 m ? high side output leakage current r ilh - 0 10 a no switching low side output leakage current r ill - 0 10 a no switching
datasheet d a t a s h e e t 7/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves figure 4. operating suppl y current vs temperature figure 5. stand-by supply current vs temperature figure 6. efficiency vs load current (v in =5v, v out =1.2v, l=1.0h, freq=l) figure 7. efficiency vs load current (v in =5v, v out =1.2v, l=1.5h, freq=h) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 100 120 temperature [c] istby [ua] 0 10 20 30 40 50 60 -40-200 20406080100120 temperature [c] i cc [ua] v in =5v v in =3.3v v in =5v v in =3.3v 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency[%] mode=l mode=h 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%] mode=l mode=h v out =1.2v, freq=l v out =1.2v freq=h
datasheet d a t a s h e e t 8/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 8. efficiency vs load current (v in =5v, v out =3.3v, l=1.0h, freq=l) figure 9. efficiency vs load current (v in =5v, v out =3.3v, l=1.5h, freq=h) figure 10. fb voltage vs temperature figur e 11. uvlo threshold vs temperature 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 l oad [m a] efficiency [%] mode=l mode=h 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 l oad [m a] efficiency [%] mode=l mode=h v out =3.3v, freq=l v out =3.3v freq=h 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 -40-200 20406080100120 temperature [c] v fb [v] v in =5v v in =3.3v 2.36 2.40 2.44 2.48 2.52 2.56 2.60 -40 -20 0 20 40 60 80 100 120 temperature [c] v uvlo [v] release detect
datasheet d a t a s h e e t 9/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 14. freq threshold vs temperature fi gure 15. freq input current vs temperature figure 12. en threshold vs temperature fi gure 13. en input current vs temperature 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -40 -20 0 20 40 60 80 100 120 temperature [c] v en [v] up down 0 2 4 6 8 10 -40-200 20406080100120 temperature [c] i en [ a] v in =5v v in =3.3v v in =5.0v 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -40-200 20406080100120 temperature [c] v freq [v] v in =5v v in =3.3v 0.0 0.5 1.0 1.5 2.0 2.5 -40 -20 0 20 40 60 80 100 120 temperature [c] i freq [ a] v in =5v
datasheet d a t a s h e e t 10/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 18. high side on-resistance vs temperature figure 19. low side on-resistance vs temperature figure 16. mode threshold voltage vs temperature figure 17. mode input current vs temperature 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -40 -20 0 20 40 60 80 100 120 temperature [c] v mode [v] v in =5v v in =3.3v 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -40 -20 0 20 40 60 80 100 120 temperature [c] i mode [ a] v in =5v 25 30 35 40 45 50 55 -40-200 20406080100120 temperature [c] r onh [m ? ] v in =5v v in =3.3v 25 30 35 40 45 50 55 -40-200 20406080100120 temperature [c] r onl [m ? ] v in =5v v in =3.3v
datasheet d a t a s h e e t 11/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 22. soft start time vs temperature figure 23. ss terminal current vs temperature figure 20. pgd threshold vs temperature figur e 21. pgd on on-resistance vs temperature 70 80 90 100 110 120 130 -40-20 0 20 40 60 80100120 temperature [c] r pgd [ ? ] 60 65 70 75 80 85 -40-200 20406080100120 temperature [c] v pgd [%] rising falling v in =5v v in =3.3v 0.0 0.5 1.0 1.5 2.0 -40 -20 0 20 40 60 80 100 120 temperature [c] i ss [ a] v in =5v v in =3.3v 0.0 0.5 1.0 1.5 2.0 -40 -20 0 20 40 60 80 100 120 temperature [c] t ss [msec] v in =5v v in = 3.3v
datasheet d a t a s h e e t 12/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 26. switching frequency vs input voltage figure 27. switching frequency vs input voltage figure 24. switching frequency vs load current figure 25. switching frequency vs load current 800 850 900 950 1000 1050 1100 1150 1200 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage [v] f sw [khz] 0 200 400 600 800 1000 1200 0 500 1000 1500 2000 2500 3000 load current [ma] f sw [khz] mode=l mode=h freq=h v in =5v 0 400 800 1200 1600 2000 2400 0 500 1000 1500 2000 2500 3000 load current [ma] f sw [khz] mode=l mode=h freq=l v in =5v 1600 1700 1800 1900 2000 2100 2200 2300 2400 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage [v] f sw [khz] v out =1.2v mode=h freq=l i out =1a v out =1.2v mode=h freq=h i out =1a
datasheet d a t a s h e e t 13/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 30. power up waveform with vin (freq=h, r load =0.5 ? ) figure 31. power down waveform with vin (freq=h, r load =0.5 ? ) figure 28. power up waveform with en (freq=h, r load =0.5 ? ) figure 29. power down waveform with en (freq=h, r load =0.5 ? ) time=1ms/div time=1ms/div time=1ms/div time=1ms/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div
datasheet d a t a s h e e t 14/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 34. switching waveform (v in =5v, v out =1.2v, freq=h, i out =0.2a) figure 35. switching waveform (v in =5v, v out =1.2v, freq=h, i out =3a) figure 32. switching waveform (v in =5v, v out =1.2v, freq=l, i out =0.1a) figure 33. switching waveform (v in =5v, v out =1.2v, freq=l, i out =3a) time=1s/div v out =20mv/div sw=2v/div time=1 s/div v out =20mv/div sw=2v/div time=1s/div v out =20mv/div sw=2v/div time=1s/div v out =20mv/div sw=2v/div
datasheet d a t a s h e e t 15/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 typical performance curves - continued figure 36. line regulation (v out =1.2v, l=1.5 h, freq=h) figure 37. load regulation (v in =5v, v out =1.2v, l=1.5 h, freq=h) figure 38. load transient response iout=0.1a to 2a (v in =5v, v out =1.2v, freq=l, mode=l, c out =ceramic 44f) figure 39. load transient response iout=0a to 3a (v in =5v, v out =1.2v, freq=l, mode=h, c out =ceramic 44f) -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage[v] output voltage deviation[%] -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 load current [a] output voltage deviation[%] mode=h mode=l mode=l mode=h time=0.5m / div v out =50mv/div i out =1a/div time=0.5m / div v out =50mv/div i out =1a / div
datasheet d a t a s h e e t 16/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 application example(s) 1. basic operation (1) dc/dc converter operation BD9B301MUV-LB is a synchronous rectifying step-down switch ing regulator that achieves faster transient response by employing constant on-time control system. it utilizes switching operation in pwm (pulse width modulation) mode for heavier load, while it utilizes deep-sllm (deep-simple light load mode) control fo r lighter load to improve efficiency. figure 40. efficiency (deep-sllm tm control and pwm control) deep-sllm control pwm control v out 20mv/div sw 2.0v/div v out 20mv/div sw 2.0v/div pwm control efficiency [%] output current iout [a] deep-sllm control figure 41. switching waveform at deep-sllm control (v in =5.0v, v out =1.2v, i out =100ma) figure 42. switching waveform at pwm control (v in =5.0v, v out =1.2v, i out =3a)
datasheet d a t a s h e e t 17/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 (2) enable control the ic shutdown can be controlled by the voltage applied to the en terminal. when ven reaches 2.0 v(typ), the internal circuit is activated and the ic starts up. to enable shutdown control with the en terminal, the shutdown interval (low level interval of en) must be set to 100 s or longer. startup by en must be at the same time or after the input of power supply voltage. figure 43. start up and down with enable (3) power good when the output voltage reaches more than 80% of the voltage setting, the open drain nmosfet, internally connected to the pgd terminal, turns of f and the pgd terminal turns to hi-z c ondition. also when the output voltage falls below 70% of voltage setting, the open drain nmos fet turns on and pgd terminal pulls down with 100 ? . connecting a pull up resistor (10k ? to 100k ? ) is recommended. figure 44. power good timing chart (4) soft start when en terminal is turned high, soft start operates and out put voltage gradually rises. with the soft start function, over shoot of output voltage and rush current can be prev ented. rising time of output voltage when ss terminal is open is 1msec (typ). capacitor connected to ss terminal ma kes rising time more than 1msec. please refer to page 23 for the method of setting rising time. figure 45. soft start timing chart v en 0 v out 0 soft start 1 msec (typ.) v enh v enl en terminal output setting voltage t t
datasheet d a t a s h e e t 18/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 2 . protection the protective circuits are intended for prevention of damage caused by unexpected accidents. do not use them for continuous protective operation (1) over current protection (ocp) / short circuit protection (scp) setting of over current protection is 5. 5a (typ). when ocp is triggered, over current protection is realized by restricting on / off duty of current flowing in upper mosfet by each switching cycle. also , if over current protection operates 512 cycles in a condition where fb terminal voltag e reaches below 70% of internal standard voltage, short circuit protection (scp) operates and st ops switching for 1msec (typ) before it initiates restart. however, during startup, short circuit protection will not operat e even if the ic is still in the scp condition. table 1. over current protection / short circuit protection function en terminal pgd startup over current protection short circuit protection more than 2.0v l while start up valid invalid startup completed valid valid h valid invalid less than 0.8v invalid invalid figure 46. short circuit protection (scp) timing chart v out fb high side mosfet gate 1ms(typ.) low side mosfet gate coil current inside ic ocp signal pgd ocp threshold 1024 cycle
datasheet d a t a s h e e t 19/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 (2) under voltage lockout protection (uvlo) the under voltage lockout protection circuit monitors the avin terminal voltage. the operation enters standby when the avin terminal voltage is 2.45v (typ) or lower. the operation starts when the avin terminal voltage is 2.55v (typ) or higher. figure 47. uvlo timing chart (3) thermal shutdown when the chip temperature exceeds tj=175 ? c (typ), the dc/dc converter output is stopped. the circuits are automatically restored to normal oper ation when the chip temperature falls. it has a hysteresis of 25 ? c (typ). the thermal shutdown circuit is intended for shutting down the ic from thermal runaway in an abnormal state with the temperature exceeding tjmax=150 ? c. it is not meant to protect or guarant ee the soundness of the application. do not use the function of this circui t for application protection design. v in 0v v out high side mosfet gate fb terminal soft start hys uvlo off uvlo on normal operation normal operation uvlo low side mosfet gate
datasheet d a t a s h e e t 20/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 application example figure 48. application circuit table 2. recommended component values (v in =5v, freq=h) reference designator v out description 1.0v 1.2v 1.5v 1.8v 3.3v r5 100k ? 100k ? 100k ? 100k ? 100k ? - r7 75k ? 75k ? 160k ? 150k ? 160k ? - r8 300k ? 150k ? 180k ? 120k ? 51k ? - c2 (note 3) 10 f 10 f 10 f 10 f 10 f 10v, x5r, 3216 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 1608 c8 (note 4) 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c10 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c14 120p 120pf 150pf 180pf 180pf - l1 1.5 h 1.5 h 1.5 h 1.5 h 1.5 h toko, fdsd0630 table 3. recommended component values (v in =5v, freq=l) reference designator v out description 1.0v 1.2v 1.5v 1.8v 3.3v r5 100k ? 100k ? 100k ? 100k ? 100k ? - r7 75k ? 75k ? 160k ? 150k ? 160k ? - r8 300k ? 150k ? 180k ? 120k ? 51k ? - c2 (note 3) 10 f 10 f 10 f 10 f 10 f 10v, x5r, 3216 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 1608 c8 (note 4) 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c10 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c14 100p 120pf 100pf 120pf 120pf - l1 1.0 h 1.0 h 1.0 h 1.0 h 1.0 h toko, fdsd0630 (note 3) for capacitance of input capacitor take temperature char acteristics, dc bias characterist ics, etc. into consideration to set minimum value to no less than 4.7 f. (note 4) for capacitance of bootstrap capacitor take temperature characteristics, dc bias chara cteristics, etc. into considera tion to set minimum value to no less than 0.047 f.
datasheet d a t a s h e e t 21/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 selection of components externally connected 1. output lc filter constant in order to supply a continuous current to the load, t he dc/dc converter requires an lc filter for smoothing the output voltage. it is recommended to use inductors of valu es 0.47h to 1.0h when freq=l or 1.0h to 1.5h at freq=h. figure 49. waveform of current through inductor figure 50. output lc filter circuit inductor ripple current ? il where: vin= 5v vout= 1.2v l=1.5h fosc=1mhz (switching frequency) the saturation current of the inductor mu st be larger than the sum of the maximu m output current and 1/2 of the inductor ripple current ? il. the output capacitor cout affects the output ripple voltage c haracteristics. the output capacitor cout must satisfy the required ripple voltage characteristics. the output ripple voltage can be repr esented by the following equation. where r esr is the equivalent series resistance (esr) of the output capacitor. * the capacitor rating must allow a sufficient margin with respect to the output voltage. the output ripple voltage can be decreased with a smaller esr. a ceramic capacitor of about 22 f to 47 f is recommended. *be careful of total capacitance value, when additional capacitor c load is connected in addition to output capacitor c out . use maximum additional capacitor c load (max) condition which satisfies the following condition. maximum starting inductor ripple current i lstart can be expressed using the following equation. i l t inductor saturation current > i outmax + S i l /2 i outmax average inductor current S i l ?? ma 60 8 l f v 1 v v v os c i n ou t i n ou t - l i 3.8amin limi t curren t ove r i l curren t rippl e inducto r startin g maximu m start 2 i i capacitor outpu t t o curren t charg e current i outpu t startin g maximu m i l l ca p oma x star t ?? v f c 8 1 r i v os c out es r l rp l
datasheet d a t a s h e e t 22/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 charge current to output capacitor i cap can be expressed using the following equation. for example, given v in = 5v, v out = 3.3v, l= 1.5h, switching frequency f osc = 800khz(min), output capacitor c out = 44f, soft start time t ss = 0.5ms(min), and load current during soft start i oss = 3a, maximum c load can be computed using the following equation. if the value of c load is large, and cannot meet the above equat ion, adjust the value of the capacitor c ss to meet the condition below. (refer to the following items (3) soft start setting equation of time t ss and soft-start value of the capacitor to be connected to the c ss .) for example, given v in = 5v, v out = 3.3v, l = 1.5h, load current during soft start i oss = 3a, switching frequency f osc = 800khz (min), output capacitor c out = 44f, v fb = 0.792v(max), i ss = 2.0a(max), with c load = 220uf, capacitor c ss is computed as follows. 2. output voltage setting the output voltage value can be set by the feedback resistance ratio. for stable operation, it is recommended to use feedback resistance r1 of more than 20k ? . figure 51. feedback resistor circuit v out r1 r2 fb error amplifier 0.8v ?? v 0. 8 r 2 r 2 r 1 v out [] a s s ou t loa d ou t ca p t v c c i ?? f 6.3 8 c \ v t / 2 l i \ i \ 3. 8 max c ou t ou t s s os s loa d ? ou t s s s s ou t f b l os s loa d c \ c i v v / 2 i \ i \ 3. 8 max c ?? pf 661 7 c c v / 2 i \ i \ 3. 8 i v c ou t loa d f b l os s s s ou t s s ? 1 ou t 2 r 0. 8 \ v 0. 8 r
datasheet d a t a s h e e t 23/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 3. soft start setting turning the en terminal signal high activates the soft start function. this causes the output voltage to rise gradually while the current at star tup is placed under control. this allows t he prevention of output voltage overshoot and inrush current. the rise time depends on the value of the capacitor connected to the ss terminal. turning the en terminal signal high with the ss terminal open or with the terminal signal high (no capacitor connected) causes the output voltage to rise in 1msec (typ). 4. fb capacitor generally, in fixed on time control (hysteresis control), su fficient ripple voltage in fb voltage is needed to operate comparator stably. regarding this ic, by injecting ripple voltage to fb voltage inside ic it is designed to correspond to low esr output capacitor. please set the fb capacitor wi thin the range of the following expression to inject an appropriate ripple. ?? ?? ?? ?? msec a v f with current source terminal start soft is (typ)) (0.8v voltage terminal fb is terminal time start soft to connected capacitor is time start soft is : where 8. 0 / 1. 0 0. 8 0.0 1 t 0.01 c i v c t / v t i c / i v c t ss ss ss fb ss ss fb ss ss ss s s f b s s s s ) , f )) (1.0a(typ frequency switching is voltage output is voltage input is sw out in sw in ou t out fb sw in ou t out f v v 10 3.6 f v v \ 1 v c 10 7.5 f v v \ 1 v 3 3 : where
datasheet d a t a s h e e t 24/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 pcb layout design in the step-down dc/dc converter, a large pulse current flows into two loops. the first loop is the one into which the current flows when the high-side fet is turned on. the flow starts from the input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to gnd of c in via gnd of c out . the second loop is the one into which the current flows when the low-side fet is turned on. the flow starts from the low-side fet, runs through the inductor l and output capacitor c out and back to gnd of the low-side fet via gnd of c out . route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. it is recommended to connect the input and output capacitors directly to the gnd plane. the pcb layout has a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics. accordingly, design the pcb layout considering the following points. ? connect an input capacitor as close as possible to the ic pvin terminal on the same plane as the ic. ? if there is any unused area on the pcb, provide a copper foil plane for the gnd node to assist heat dissipation from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. route the coil pattern as thick and as short as possible. ? provide lines connected to fb far from the sw nodes. ? place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. power dissipation when designing the pcb layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. figure 52. current loop of buck converter figure 53. thermal derating characteristics (vqfn016v3030) a llowable power dissipation: pd [w] ambient temperature: ta [c] ( 1) 4-layer board (surface heat dissipation copper foil 5505 mm 2 ) (copper foil laminated on each layer) ja = 47.0c/w (2) 4-layer board (surface heat dissipation copper foil 6.28 mm 2 ) (copper foil laminated on each layer) ja = 70.62c/w (3) 1-layer board (surface heat dissipation copper foil 6.28 mm 2 ) ja = 201.6c/w (4) ic only ja = 462.9c/w board specification: glass-epoxy, 70mm x 70mm x 1.6mm copper foil thickness: front side and reverse side 70m be used, 2nd and 3rd 35m be used. 0 25 50 75 100 125 150 0 2.0 3.0 4.0 (2)1.77 w (1)2.66 w (3)0.62 w (4)0.27 w
datasheet d a t a s h e e t 25/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 i/o equivalence circuit(s) 6. fb 7. freq 8. mode 9. ss 10.11.12. sw 13. boot 14. pgd 15. en sw pvin boot boot pvin sw pvin
datasheet d a t a s h e e t 26/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet d a t a s h e e t 27/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 54. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
datasheet d a t a s h e e t 28/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 ordering information b d 9 b 3 0 1 m u v - l b e 2 part number package vqfn016v3030 product class lb: for industrial applications packaging and forming specification e2: embossed tape and reel marking diagrams vqfn016v3030 (top view) d9b part number marking lot number 1pin mark 301
datasheet d a t a s h e e t 29/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 physical dimension, tape and reel information package name vqfn016v3030 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 30/30 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B301MUV-LB tsz02201-0j3j0aj00830-1-2 2015.04.02 rev.001 revision history date revision changes 02.apr.2015 001 new release
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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